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sa53 sa53u p r o d u c t i n n o v a t i o n f r o m description the sa53 is a fully integrated switching amplifer de - signed primarily to drive dc brush motors. two inde - pendent half bridges provide over 10 amperes peak output current under microcontroller or dsc control. thermal and short circuit monitoring is provided, which generates fault signals for the microcontroller to take appropriate action. a block diagram is provided in fig - ure 1. additionally, cycle-by-cycle current limit offers user programmable hardware protection independent of the microcontroller. output current is measured using an innovative low loss technique. the sa53 is built using a multi-technology process allowing cmos logic con - trol and complementary dmos output power devices on the same ic. use of p-channel high side fets en - ables 60v operation without bootstrap or charge pump circuitry. the power quad surface mount package balances ex - cellent thermal performance with the advantages of a low profle surface mount package. features ? low cost intelligent switching amplifer ? directly connects to most embedded micro - controllers and digital signal controllers ? integrated gate driver logic with dead-time generation and shoot-through prevention ? wide power supply range (8.5 v to 60 v) ? over 10a peak output current per phase ? 3a continuous output current per phase ? independent current sensing for each output ? user programmable cycle-by-cycle current limit protection ? over-current and over-temperature warning signals applications ? bidirectional dc brush motors ? 2 unidirectional dc brush motors ? 2 independent solenoid actuators ? stepper motors switching amplifier sa53 p r o d u c t i n n o v a t i o n f r o m figure . block diagram copyright ? cirrus logic, inc. 2009 (all rights reserved) http://www.cirrus.com m ay 2009 apex ? sa53ureva s a 53 s w i t c h i n g a m p l i f i e r v s 1 p g n d 1 g a t e c o n t r o l p w m s i g n a l s o u t 1 o u t 2 p g n d 2 t e m p gnd v s 2 v s + i lim / d i s 1 s c d i s 2 s g n d p h a s e 1 p h a s e 2 c o n t r o l l o g i c v dd i 1' i 2' i 1' i 2' f a u l t l o g i c i 1 i 2 1t 1b 2t 2b v dd v dd
sa53 2 sa53u p r o d u c t i n n o v a t i o n f r o m . ch aracteristics and s pecifications absolute maximum r atings parameter symbol min max units supply voltage v s 60 v supply voltage v dd 5.5 v logic input voltage (-0.5) (v dd +0.5) v output current, peak, 10ms (note 2) i out 10 a power dissipation, avg, 25oc (note 2) p d 100 w temperature, solder, 10sec t s 260 c temperature, junction (note 2) t j 150 c temperature range, storage t stg ?55 125 c operating temperature, case t a ?40 125 c para meter test conditions (note 1) min typ max units logic input low 1 v input high 1.8 v output low 0.3 v output high 3.7 v output current (sc, temp, i lim /dis1) 50 ma power supply v s uvlo 50 60 v v s undervoltage lockout, (uvlo) 8.3 v v dd 4.5 5.5 v supply current, v s 20 khz (one phase switching at 50% duty cycle) , v s =50v, v dd =5v 25 30 ma supply current, v dd 20 khz (one phase switching at 50% duty cycle) , v s =50v, v dd =5v 5 6 ma current limit current limit t hreshold (v th ) 3.75 v v th hysteresis 100 mv output current, continuous 25oc case temperature 3 a rising delay , td (rise) see figure 10 270 ns f alling delay , td ( fall) see figure 10 270 ns disable delay , td (dis) see figure 10 200 ns enable delay , td ( dis ) see figure 10 200 ns rise time, t (rise) see figure 11 50 ns f all t ime, t ( fall) see figure 11 50 ns on resistance sourcing (p-channel) 3a load 400 m? on resistance sinking (n-channel) 3a load 400 m? s pecifications
sa53 sa53u 3 p r o d u c t i n n o v a t i o n f r o m notes: 1. (all min/max characteristics and specifcations are guaranteed over the specifed operating condi - tions. typical performance characteristics and specifcations are derived from measurements taken at typical supply voltages and t c = 25c). 2. long term operation at elevated temperature will result in reduced product life. de-rate internal power dissipation to achieve high mtbf. 3. output current rating may be limited by duty cycle, ambient temperature, and heat sinking. under any set of conditions, do not exceed the specifed current rating or a junction temperature of 150c. para meter test conditions (note 1) min typ max units thermal thermal w arning 135 oc thermal w arning hysteresis 40 oc resistance, junction to case full temperature range 1.25 1.5 oc/w temperature range, case meets specifcations -40 85 oc figure 2. 64-pin qfp, package style hq s pecifications, continued
sa53 4 sa53u p r o d u c t i n n o v a t i o n f r o m diode forward voltage - top fet (p-channel) 0 1 2 3 4 5 forward voltage (v) current (a) 0.5 1.5 1.3 1.1 0.9 0.7 diode forward voltage - bottom fet (n-channel) 0 1 2 3 4 5 forward voltage (v) current (a) 0.5 1.5 1.3 1.1 0.9 0.7 on resistance - top fet 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 i out ,(a) rds(on),(?) v s =11 v s =13 v s =15 v s >17 10 0 9 8 7 6 5 4 3 2 1 (p-channel) on resistance - bottom fet 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 10 i out ,(a) rds(on),(?) v s =11 v s =13 v s =15 v s =17 v s >22 0 9 8 7 6 5 4 3 2 1 (n-channel) power derating 0 20 40 60 80 100 120 case temperature, t c power dissipation, p d -40 120 80 40 0 v dd supply current 4.5 4.6 4.7 4.8 4.9 5 0 50 100 150 200 250 300 frequency ( khz ) v dd supply current (ma) one phase switching @ 50% duty cycle; v s =50v v dd supply current 4 4.5 5 5.5 6 6.5 7 7.5 8 10 20 30 40 50 60 v s supply voltage (v) v dd supply current ( m a) one phase switching frequency = 20 khz 50% duty cycle 25c 125c current sense 0.1 1 10 0.01 0.1 1 10 sense current ( m a) load current (a) v s supply current 20 40 60 80 100 120 140 160 180 0 50 100 150 200 250 300 frequency ( khz ) v s supply current (ma) one phase switching @ 50% duty cycle; v s =50v 0 v s supply current 0 5 10 15 20 25 v s supply voltage (v) v s supply current ( m a) 125c 25c one phase switching frequency = 20 khz 50% duty cycle 10 20 30 40 50 60
sa53 sa53u 5 p r o d u c t i n n o v a t i o n f r o m figure 3. ex ternal connections 53 54 55 56 57 58 59 60 61 62 63 64 32 31 30 29 28 27 26 25 24 23 22 21 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 out 2 out 2 nc v s 2 v s 2 v s 2 v s 2 nc nc nc nc nc pgnd 1 pgnd 1 pgnd 1 pgnd 1 nc out 1 out 1 out 1 i2 nc sc nc sgnd nc i lim /dis1 nc sgnd nc sgnd nc sgnd nc 1b nc 1t nc v dd nc out 2 nc pgnd 2 pgnd 2 pgnd 2 hs hs nc 2b nc 2t nc nc v s 1 v s 1 v s 1 nc hs hs temp nc dis2 nc i1 t able . pin descriptions pin # pin name signal type simplifed pin description 29,30,31 v s (phase 1) power high voltage supply (8.5-60v) supplies phase 1 only 51,52,53 out 2 power output half bridge 2 power output 55,56,57 pgnd (phase 2) power high current gnd return path for power output 2 3 sc logic output indication of a short of an output to supply, gnd or another phase 61 2b logic input logic high commands 2 phase lower fet to turn on 63 2t logic input logic high commands 2 phase upper fet to turn on 1 i2 analog output phase 2 current sense output 7 i lim /dis1 logic input/output as an output, logic high indicates cycle-by-cycle current limit, and logic low indicates normal operation. as an input, logic high places all outputs in a high impedance state and logic low disables the cycle-by-cycle current limit function.
sa53 6 sa53u p r o d u c t i n n o v a t i o n f r o m t able . pin descriptions pin # pin name signal type simplifed pin description 5,9,11,13 sgnd power analog and digital gnd C internally connected to pgnd 15 1b logic input logic high commands 1 phase lower fet to turn on 17 1t logic input logic high commands 1 phase upper fet to turn on 19 v dd power logic supply (5v) 21 i1 analog output phase 1 current sense output 23 dis2 logic input logic high places all outputs in a high impedance state 25 temp logic output thermal indication of die temperature above 135oc 46,47,48,49 v s (phase 2) power high voltage supply phase 2 33,34,35 out 1 power output half bridge 1 power output 37,38,39,40 pgnd (phase 1) power high current gnd return path for power outputs 1&2 26,27,58,59 hs mechanical pins connected to the package heat slug 2,4,6,8,10, 12,14,16,18, 20,22,24,28, 32,36,41,42, 43,44,45,50, 54,60,62,64 nc --- do not connect .2 pin descriptions v s : supply voltage for the output transistors. these pins require decoupling (1f capacitor with good high fre - quency characteristics is recommended) to the pgnd pins. the decoupling capacitor should be located as close to the v s and pgnd pins as possible. additional capacitance will be required at the v s pins to handle load current peaks and potential motor regeneration. refer to the applications section of this datasheet for additional discussion regarding bypass capacitor selection. note that v s pins 29-31 carry only the phase 1 supply current. pins 46-49 carry supply current for phase 2. phase 1 may be operated at a different supply voltage from phase 2. both v s voltages are monitored for undervoltage conditions. out , out 2: these pins are the power output connections to the load. note: when driving an inductive load, it is recommended that two schottky diodes with good switching characteristics (fast t rr specs) be connected to each pin so that they are in parallel with the parasitic back-body diodes of the output fet s. (see section 2.6) pgnd: power ground. this is the ground return connection for the output fets. return current from the load fows through these pins. pgnd is internally connected to sgnd through a resistance of a few ohms. see section 2.1 of this datasheet for more details. sc: short circuit output. if a condition is detected on any output which is not in accordance with the input com - mands, this indicates a short circuit condition and the sc pin goes high. the sc signal is blanked for approxi - mately 200ns during switching transitions but in high current applications, short glitches may appear on the sc pin. a high state on the sc output will not automatically disable the device. the sc pin includes an internal 12k series resistor. b, 2b: these schmitt triggered logic level inputs are responsible for turning the associated bottom, or lower n- channel output fets on and off. logic high turns the bottom n-channel fet on, and a logic low turns the low side n-channel fet off. if 2b or 2b is high at the same time that a corresponding 1t or 2t input is high, protection circuitry will turn off both fets in order to prevent shoot-through on that output phase. protection circuitry also includes a dead-time generator, which inserts dead time in the outputs in the case of simultaneous switching of the top and bottom input signals. t, 2t: these schmitt triggered logic level inputs are responsible for turning the associated top side, or upper p- channel fet outputs on and off. logic high turns the top p-channel fet on, and a logic low turns the top p- channel fet off.
sa53 sa53u p r o d u c t i n n o v a t i o n f r o m i, i2: current sense pins. the sa53 supplies a positive current to these pins which is proportional to the current fowing through the top side p-channel fet for that phase. commutating currents fowing through the backbody diode of the p-channel fet or through external schottky diodes are not registered on the current sense pins. nor do currents fowing through the low side n-channel fet, in either direction, register at the current sense pins. a resistor connected from a current sense pin to sgnd creates a voltage signal representation of the phase current that can be monitored with adc inputs of a processor or external circuitry. the current sense pins are also internally compared with the current limit threshold voltage reference, vth. if the voltage on any current sense pin exceeds vth, the cycle by cycle current limit circuit engages. details of this functionality are described in the applications section of this datasheet. i lim /dis: this pin is directly connected to the disable circuitry of the sa53. pulling this pin to logic high places out 1 and out 2 in a high impedance state. this pin is also connected internally to the output of the current limit latch through a 12k resistor and can be monitored to observe the function of the cycle-by-cycle current limit feature. pulling this pin to a logic low effectively disables the cycle-by-cycle current limit feature. sgnd: this is the ground return connection for the v dd logic power supply pin. all internal analog and logic circuitry is referenced to this pin. pgnd is internally connected to gnd through a resistance of a few ohms,. however, it is highly recommended to connect the gnd pin to the pgnd pins externally as close to the device as possible. failure do to this may result in oscillations on the output pins during rising or falling edges. v dd : this is the connection for the 5v power supply, and provides power for the logic and analog circuitry in the sa53. this pin requires decoupling (at least 0.1f capacitor with good high frequency characteristics is recom - mended) to the sgnd pin. dis2: the dis2 pin is a schmitt triggered logic level input that places out 1 and out 2 in a high impedance state when pulled high. dis2 has an internal 12k pull-down resistor and may therefore be left unconnected. temp: this logic level output goes high when the die temperature of the sa53 reaches approximately 135oc. this pin will not automatically disable the device. the temp pin includes a 12k series resistor. hs: these pins are internally connected to the thermal slug on the reverse of the package. they should be con - nected to gnd. neither the heat slug nor these pins should be used to carry high current. nc: these no-connect pins should be left unconnected. 2. sa53 operation the sa53 is designed primarily to drive dc brush motors. however, it can be used for any application requiring two high current outputs. the signal set of the sa53 is designed specifcally to interface with a dsp or microcontroller. a typical system block diagram is shown in the fgure below. over-temperature, short-circuit and current limit fault signals provide important feedback to the system controller which can safely disable the output drivers in the pres - ence of a fault condition. high side current monitors for both phases provide performance information which can be used to regulate or limit torque.
sa53 sa53u p r o d u c t i n n o v a t i o n f r o m figure 4. system diagram sa53 switching amplifier dc brush motor vs 1 pgnd 1 current monitor signals 1 2 out 1 out 2 pgnd 2 gnd vs 2 vs + gnd sgnd g a t e c o n t r o l c o n t r o l l o g i c f a u l t l o g i c t e m p i lim / d i s 1 s c i 1 i 2 v dd p w m s i g n a l s d i s 2 s g n d 1t 1b 2t 2b m i c r o c o n t r o l l e r or dsc
sa53 sa53u 9 p r o d u c t i n n o v a t i o n f r o m sgnd gate control vs out 1 pgnd 1t 1b sc temp sc logic temp sense ref i1 dis2 i lim /dis1 uvlo i1' + _ lim 2 + _ vdd lim 1 current sense 12k 12k 12k 12k vth the block diagram in figure 5 illustrates the features of the input and output structures of the sa53. for simplicity, a single phase is shown. figure 5. i nput and output structures for a single phase table 2. truth t able 1t, 2t 1b, 2b i1, i2 i lim / dis 1 d is 2 out 1 out 2 comments 0 0 x x x high-z top and bottom output fets for that phase are turned off. 0 1 v th 1 x high-z voltage on i1 or i2 has exceeded vth, which causes i lim /dis 1 to go high. this internally disables top and bottom output fets for all phases. x x x x 1 high-z dis 2 pin pulled high, which disables all outputs. x x x pulled high x high-z pulling the i lim /dis 1 pin high externally acts as a second disable input, which disables all output fets. x x x pulled low 0 determined by pwm inputs pulling the dis 2 pin low externally disables the cycle-by-cycle current limit function. the state of the outputs is strictly a function of the pwm inputs. x x x x x high-z if v s is below the uvlo threshold all output fets will be disabled.
sa53 0 sa53u p r o d u c t i n n o v a t i o n f r o m 2. layout considerations output traces carry signals with very high dv/dt and di/dt. proper routing and adequate power supply bypassing ensures normal operation. poor routing and bypassing can cause erratic and low effciency operation as well as ringing at the outputs. the v s supply should be bypassed with a surface mount ceramic capacitor mounted as close as possible to the v s pins. total inductance of the routing from the capacitor to the v s and gnd pins must be kept to a minimum to pre - vent noise from contaminating the logic control signals. a low esr capacitor of at least 25f per ampere of output current should be placed near the sa53 as well. capacitor types rated for switching applications are the only types that should be considered. the bypassing requirements of the v dd supply are less stringent, but still necessary. a 0.1f to 0.47f surface mount ceramic capacitor (x7r or npo) connected directly to the v dd pin is suffcient. sgnd and pgnd pins are connected internally. however, these pins must be connected externally in such a way that there is no motor current fowing in the logic and signal ground traces as parasitic resistances in the small signal routing can develop suffcient voltage drops to erroneously trigger input transitions. alternatively, a ground plane may be separated into power and logic sections connected by a pair of back to back schottky diodes. this isolates noise between signal and power ground traces and prevents high currents from passing between the plane sections. unused area on the top and bottom pcb planes should be flled with solid or hatched copper to minimize inductive coupling between signals. the copper fll may be left unconnected, although a ground plane is recommended. 2.2 fault indications in the case of either an over-temperature or short circuit fault, the sa53 will take no action to disable the outputs. instead, the sc and temp signals are provided to an external controller, where a determination can be made re - garding the appropriate course of action. in most cases, the sc pin would be connected to a fault input on the processor, which would immediately disable its pwm outputs. the temp fault does not require such an immediate response, and would typically be connected to a gpio, or keyboard interrupt pin of the processor. in this case, the processor would recognize the condition as an external interrupt, which could be processed in software via an interrupt service routine. the processor could optionally bring all inputs low, or assert a high level to either of the disable inputs on the sa53. figure 6 shows an external sr fip-fop which provides a hard wired shutdown of all outputs in response to a fault in - dication. an sc or temp fault sets the latch, pulling the disable pin high. the processor clears the latched condition with a gpio. this circuit can be used in safety critical applications to remove software from the fault-shut - down loop, or simply to reduce processor overhead. in applications which may not have available gpio, the temp pin may be externally connected to the adjacent dis1 pin. if the device temperature reach - es ~135oc all outputs will be disabled, de-energizing the motor. the sa53 will re-energize the motor when the device temperature falls below approximately 95oc. the temp pin hysteresis is wide to reduce the likelihood of thermal oscillations which can greatly reduce the life of the device. 2.3 under-voltage lockout the undervoltage lockout condition results in the sa53 unilaterally disabling all output fets until vs is above the uvlo threshold indicated in the spec table. there is no external signal indicating that an undervoltage lock- out condition is in progress. the sa53 has two v s connections: one for phase 1 and another for phase 2. the supply voltages on these pins need not be the same, but the uvlo will engage if either is below the threshold. hysteresis on the uvlo circuit prevents oscillations with typical power supply variations. figure 6. ex ternal f ault l atch circuit s a 53 p r o c e ss o r i n t e rr up t g p i o p w m s c d i s 2 t e m p l a t c h e d f a u l t f a u l t r ese t
sa53 sa53u p r o d u c t i n n o v a t i o n f r o m 2.4 current sense external power shunt resistors are not required with the sa53. forward current in each top, pchannel output fet is measured and mirrored to the respective current sense output pin, ia, ib and ic. by connecting a resistor between each cur - rent sense pin and a reference, such as ground, a voltage develops across the resistor that is pro - portional to the output current for that phase. an adc can monitor the voltages on these resistors for protection or for closed loop torque control in some application confgurations. the current sense pins source current from the v dd supply. headroom required for the current sense circuit is approximately 0.5v. the nominal scale factor for each proportional output current is shown in the typical performance plot on page 4 of this data - sheet. 2.5 cycle-by-cycle current limit in applications where the current in the motor is not directly controlled, both the average current rating of the mo - tor and the inrush current must be considered when selecting a proper amplifer. for example, a 1a continuous motor might require a drive amplifer that can deliver well over 10a peak in order to survive the inrush condition at startup. because the output current of each upper output fet is measured, the sa53 is able to provide a very robust current limit scheme. this enables the sa53 to safely and easily drive virtually any dc brush motor through a startup inrush condition. with limited current, the starting torque and acceleration are also limited. the plot in figure 7 shows start - ing current and back emf with and without current limit enabled. if the voltage of any of the two current sense pins exceeds the current limit threshold voltage (vth), all outputs are disabled. after all current sense pins fall below the vth threshold voltage and the offending phases top side input goes low, the output stage will return to an active state on the rising edge of any top side input command signal (1t or 2t). with most commutation schemes, the current limit will reset each pwm cycle. this scheme regulates the peak current in each phase during each pwm cycle as illustrated in the timing diagram below. the ratio of average to peak current depends on the inductance of the motor winding, the back emf developed in the motor, and the width of the pulse. figure 8 illustrates the current limit trigger and reset sequence. current limit engages and i lim /dis1 goes high when any current sense pin exceeds vth. notice that the moment at which the current sense signal exceeds the vth threshold is asynchronous with respect to the input pwm signal. the difference between the pwm period and the motor winding l/r time constant will often result in an audible beat frequency sometimes called a sub-cycle oscil - lation. this oscillation can be seen on the i lim /dis1 pin waveform in figure 8. input signals commanding 0% or 100% duty cycle may be incompatible with the current limit feature due to the absence of rising edges of 1t and 2t except when commutating phases. at high rpm, this may result in poor performance. at low rpm, the motor may stall if the cur - rent limit trips and the motor current reaches zero without a commutation edge which will typically reset the current limit latch. the current limit feature may be disabled by tying the i lim /dis1 pin to gnd. the current sense pins will continue to provide top fet output current information. t i m e non-l i m i t e d b a c k emf li m i t e d b a ck e m f li m i t e d m o t o r c ur r ent non-l i m i t e d m o t or c u rre n t figure 7. s tart -up v oltage and current
sa53 2 sa53u p r o d u c t i n n o v a t i o n f r o m typically, the current sense pins source current into grounded resistors which pro - vide voltages to the current limit compara - tors. if instead the current limit resistors are connected to a voltage output dac, the current limit can be controlled dynamically from the system controller. this technique essentially reduces the current limit thresh - old voltage to (vth-vdac). during expect - ed conditions of high torque demand, such as start-up or reversal, the dac can adjust the current limit dynamically to allow pe - riods of high current. in normal operation when low current is expected, the dac output voltage can increase, reducing the current limit setting to provide more con - servative fault protection. 2.6 external flyback diodes external fy-back diodes will offer superior reverse recovery characteristics and low - er forward voltage drop than the internal back-body diodes. in high current applica - tions, external fyback diodes can reduce power dissipation and heat - ing during commutation of the motor current. reverse recovery time and capacitance are the most important parameters to consider when selecting these diodes. ultra-fast rectifers offer better reverse recovery time and schottky diodes typically have low capacitance. individual ap - plication requirements will be the guide when determining the need for these diodes and for selecting the component which is most suitable. i t input out 1 i1 v th i lim /dis1 figure 8. current limit w avefor ms figure 9. sch ottky diodes out 1 out 2 v s v s sa53
sa53 sa53u 3 p r o d u c t i n n o v a t i o n f r o m figure 0. timing diagrams 3. power dissipation the thermally enhanced package of the sa53 al - lows several options for managing the power dissi - pated in the three output stages. power dissipation in traditional pwm applications is a combination of output power dissipation and switching losses. output power dissipation depends on the quadrant of operation and whether external fyback diodes are used to carry the reverse or commutating cur - rents. switching losses are dependent on the fre - quency of the pwm cycle as described in the typi - cal performance graphs. the size and orientation of the heatsink must be selected to manage the average power dissipation of the sa53. applications vary widely and various thermal techniques are available to match the re - quired performance. the patent pending mounting technique shown in figure 12, with the sa53 in - verted and suspended through a cutout in the pcb is adequate for power dissipation up to 17w with the hs33, a 1.5 inch long aluminum extrusion with four fns. in free air, mounting the pcb perpendicu - lar to the ground, such that the heated air fows upward along the channels of the fns can provide a total ja of less than 14 oc/w (9w max average pd). mounting the pcb parallel to the ground impedes the fow of heated air and provides a ja of 16.66 oc/w (7.5w max average p d ). in applications in which higher power dissipation is expected or lower junction or case temperatures are required, a larger heatsink or circulated air can signifcantly improve the performance. 4. ordering and product status inform ation model tem perature packa ge production status SA53-IHZ -25 to 85oc 64 pin power qfp (hq package drawing) samples available 1q09 top input bottom input delay timing output disable td(fall) td(dis) td(rise) td(dis) td(dis) td(dis) top input bottom input output t(fall) t(rise) 20% 80% fig ure . output response
sa53 4 sa53u p r o d u c t i n n o v a t i o n f r o m figure 2. heatsink technique p atent pending c ontacting cirrus logic support for all apex precision power product questions and inquiries, call toll free 800-546-2739 in north america. for inquiries via email, please contact tucson.support@cirrus.com. international customers can also request support by contacting their local cirrus logic sales representative. to fnd the one nearest to you, go to www.cirrus.com important notice cirrus logic, inc. and its subsidiaries ("cirrus") believe that the information contained in this document is accurate and reliable. however, the information is subject to change without notice and is provided "as is" without warranty of any kind (express or implied). customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. all products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, indemnifcation, and limitation of liability. no responsibility is assumed by cirrus for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. this document is the property of cirrus and by furnishing this information, cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other intellectual property rights. cirrus owns the copyrights associated with the information contained herein and gives con - sent for copies to be made of the information only for use within your organization with respect to cirrus integrated circuits or other products of cirrus. this consent does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale. certain applications using semiconductor products may involve potential risks of death, personal injury, or severe prop - erty or environmental damage (critical applications). cirrus products are not designed, authorized or warranted to be suitable for use in products surgically implanted into the body, automotive safety or security devices, life support prod - ucts or other critical applications. inclusion of cirrus products in such applications is understood to be fully at the cus - tomers risk and cirrus disclaims and makes no warranty, express, statutory or implied, including the implied warranties of merchantability and fitness for particular purpose, with regard to any cirrus product that is used in such a manner. if the customer or customers customer uses or permits the use of cirrus products in critical applications, customer agrees, by such use, to fully indemnify cirrus, its officers, directors, employees, distributors and other agents from any and all liability, including attorneys fees and costs, that may result from or arise in connection with these uses. cirrus logic, cirrus, and the cirrus logic logo designs, apex and apex precision power are trademarks of cirrus logic, inc. all other brand and product names in this document may be trademarks or service marks of their respective owners.

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